Speaker || Tutorial || Book || Journal || Special Session || WiP || News || Tech. Co-sponsor || Intro.
Welcome to the 11th International Conference on Informatics, Electronics & Vision (ICIEV) (Hybrid mode)! It will be Technically Co-sponsored by and by . Similar to the previous ICIEV conferences in Bangladesh, Japan, and USA - the accepted and presented papers will be sent for (IEEE is on final stage now: IEEE Conference Record No.: 60640). Similar to previous conferences, indexing in and .

Work-in-progress (WIP) / Position paper: Submit by 25 Sept. 2023 (2-4 pages).

Keynote Speaker:

Björn W. Schuller, Fellow, IEEE
Imperial College London, UK;
University of Augsburg, Germany;
Title: Computing Your Health: Turning the Vision into Reality?
Mark Nixon, Fellow, IET; Fellow, IAPR;
Distinguished Fellow of the BMVA 2015 award;

President (former), IEEE Biometrics Council;
Chair (former), IAPR Fellows Committee;
University of Southampton, UK
Matthew Turk,
Fellow, ACM; Fellow, IEEE; Fellow IAPR;

President, Toyota Technological Institute at Chicago (TTIC), USA
Philip Torr FREng
Five AI/RAEng Research Chair in Computer Vision,
Royal Society Wolfson Research Merit Award Holder,

University of Oxford, UK
Shaogang Gong
Turing Fellow, Alan Turing Institute;

Queen Mary University of London, UK
Toshio Fukuda, Fellow, IEEE;
IEEE President 2020; Meijo University, Japan;
Beijing Institute of Technology, China;
Nagoya University, Japan

Invited Speaker:

Hakaru Tamukoh
Kyushu Institute of Technology, Japan
Ikuhisa Mitsugami
Hiroshima City University, Japan
Title: Human Internal State Estimation Using CV and VR Technologies
Kazuya Murao
Ritsumeikan University, Japan
Title: Wearable sensing security and applications
Sozo Inoue
Kyushu Institute of Technology, Japan

Welcome Speaker:

Anton Nijholt
University of Twente, The Netherlands
Toshio Fukuda, Fellow, IEEE;
IEEE President 2020;
Meijo University, Japan;
Beijing Institute of Technology, China;
Nagoya University, Japan

Tutorial: On-Sensor Machine Learning with ST Toolchains

Mahesh Chowdhary, Ph.D.
Fellow and Senior Director of MEMS software solutions,
STMicroelectronics based in Santa Clara, CA, USA
Swapnil Sayan Saha, Ph.D.
Algorithm Development Engineer of MEMS software solutions,
STMicroelectronics based in Santa Clara, CA, USA

The ICIEV provides vibrant opportunities for researchers, industry practitioners and students to share their research experiences, research results, ideas, review of various aspects and practical development experiences on Informatics, Electronics, Vision and related fields. Through various presentations from peer-reviewed accepted papers, Special Talks and networking - the ICIEV provides the avenue to share knowledge, make networks, and develop a community for the new researchers - based on the experiences of experts. The ICIEV will open doors for challenging research areas for the future.

The ICIEV welcomes you to be part of it - through offering Special Session, Tutorial, Workshop, Special Talk, Panel Discussion, and through submitting your research paper on and related arenas!


  • Attention: Before you submit your paper, authors are requested to read on dual-submission / plagiarism: CLICK!

  • Technical Co-sponsor: TBA (on-process)
  • Technical Co-sponsor: TBA (approved)
  • Organizer: Center for Natural Science & Engineering Research

  • Major Topics of Interest (not restricted to):

    • Electronics
    • Ubiquitous Systems
    • Sensors & Embedded Systems
    • Mechatronics & Control
    • Informatics
    • Communication & Networking
    • Vehicular Technology & ITS
    • Big Data & Cloud Computing
    • Data Mining
    • IT & Information Systems
    • Healthcare
    • Technologies for Unreached Community
    • Computer Vision

    Don't miss this opportunity to attend this conference! For any query, please write to us.

    More on partners and keynote/invited speaker of previous ICIEV series are available in Sponsors.
    FINAL PROGRAM of 10th ICIEV: Click for Final Program.
    Indexed in IEEE Xplore, SCOPUS, and Ei-Compendex (Few screenshots: Source: Compendex source list (XLSX, January 2020, 3.4 MB)
    1st ICIEV 2012 ,
    7th ICIEV 2018 ,
    8th ICIEV 2019 ,

    Special Issue in Journal:

    • TBA

    Work-in-Progress (WiP) Paper - NOT for IEEE/Book (Last date: 30 August):

    • WIP paper is NOT regular paper. Regular papers: 6 to 8 pages (double column) in IEEE template.
    • However, promising papers can be submitted to WiP sessions - so that authors can share any innovative ideas, work-in-progress reports during the conference. We engage a panel of good experts in the related fields to evaluate, advise on emerging topics. Authors can have the great opportunity to listen from a good no. of Keynote and Invited Speakers, make networking and learn from others.
    • Paper submission: 2~6 pages, as per the template.
    • Mention 'WiP: ' at the beginning of your TITLE.
    • These papers will NOT be in IEEE Xplore, but you have to present your paper at the conference.
    • As the WiP papers will not be in IEEE Xplore, after the conferences, some of the good papers can be invited for extended version as a book chapter in an edited book series in Springer. These will be decided after the recommendations from the experts who will evaluate the WiP presentations! Don't miss this learning process!
    • A panel of top experts will judge various best papers under different categories. They will also help the researchers to work better. The purpose is to allow young researchers to have exposure and learning.
    • Certificates for all participants. If any highly-promising WiP papers are found with challenging ideas/themes/scopes, the conf. may offer 'Best WiP Paper Award'.
    • Some papers from regular submission may be forwarded to WiP based on quality & originality.